Application of Epoxy Resin

Background and Overview of Epoxy Resin

Epoxy resin, abbreviated as EP, is a relatively new thermosetting resin and a polymer containing more than two epoxy groups in a molecule. It also includes macromolecular compounds generated by unclosed hydroxyl rings. According to various complex combinations, there are many kinds. The specific gravity is about 1.8, the heat-resistant temperature is 260℃, and it has wear resistance, chemical corrosion resistance and excellent electrical insulation.

Under the action of hardener, epoxy group hardens while generating hydroxyl group, resulting in amazing adhesive force, which can be described as a masterpiece of adhesive. Its bonding objects are all over metal, ceramics, wood, leather and almost all plastics. As a metal adhesive, it is called structural adhesive. As a coating, the coating film is impermeable to water and air, and has strong adhesion, which has important applications. As the base material of fiber-reinforced resin, like polyester, it can be molded at normal temperature and pressure, and it can exert better performance than polyester. Like unsaturated polyester, it has a wide range of applications, but it is used for more advanced applications.

Application of Epoxy Resin

Epoxy resins have been used in various industrial fields, such as adhesives, casting, packaging, laminating, molding, coating and insulation, because of their excellent physical properties and easy handling during curing. Epoxy resins are generally classified into liquid epoxy resin (in which epoxy resin is liquid at room temperature) and solid type (in which epoxy resin is solid at room temperature). Generally, during storage and transportation, this kind of solid epoxy resin is contained in an envelope container in the form of powder or sheet. Because of its low molecular weight, solid epoxy resin is easy to cause a phenomenon called "caking" during storage and transportation. Agglomeration is the phenomenon that particles of epoxy resin fuse and bond. Agglomeration leads to serious handling problems: it is difficult to take out the resin from the container and put it into another container for use.

In recent years, in the application of solid epoxy resin, such as powder coating or package for semiconductor, it tends to use solid epoxy resin with further lower molecular weight, in order to improve the fluidity during molding. Therefore, the above-mentioned caking problem becomes more and more serious. Therefore, epoxy resin is usually stored and transported at a cooling temperature in order to prevent caking, but there is a problem that the cost is high.